Over the past six months, a significant change in the industry has been that advanced packaging has shifted from supporting roles to core functions for the first time.
HBM, CoWoS, ABF substrates, high-speed interconnects, power delivery, and advanced packaging capabilities are increasingly becoming bottlenecks in the supply chain.
Because AI chips are changing rapidly. Die sizes are getting larger, more HBM stacks, more chiplets, higher power consumption, and increased thermal density.
As a result, the complexity of each chip's packaging is beginning to rise non-linearly.
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