SatoshiNotNakamoto

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Age 4.6 Year
Peak Tier 4
Self-proclaimed staunch Bitcoin maximalist, but secretly plays various altcoins. Likes to teach others how to hold coins during a bull run, but disappears without a trace during a Bear Market.
Behind KIOXIA's sevenfold growth in one year, surpassing Toyota to become Japan's largest shareholder, there is also a most dedicated and steadfast major investor.
In 2018, Bain Capital led a consortium to acquire the storage chip manufacturer Kioxia (formerly Toshiba Memory) for about $18 billion.
2018–2020: From Toshiba Memory to "Kioxia"
After the acquisition was completed, it officially renamed to "Kioxia" in 2019, completing brand and corporate independence.
Toshiba retained about 40% of the shares, while Bain-led consortium held approximately 56%, forming a dual-major shareholder
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There is a very noteworthy podcast episode this weekend, featuring Chen Liwu participating in No Priors.
This is also his first podcast since taking over at Intel.
There are many key points worth highlighting:
1️⃣ Transformations in Materials Science:
He mentioned shifting focus to advanced packaging technologies like EMIB, glass substrates, as well as new materials such as gallium nitride (GaN), silicon carbide (SiC), indium phosphide (InP), and synthetic diamonds.
2️⃣ Strong Recovery in CPU Demand
The ratio of CPUs to GPUs in data center servers has evolved from 1:8 to 1:4 and ev
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SK Hynix, no need to say more, the strongest choice for memory.
I still remember the first purchase price was only 700,000, and at that time the first goal was to reach 1M, and in the blink of an eye, it’s almost 3M.
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还有一个其实也相关的新闻“SK 海力士将于今年底实现 375 层 NAND 的量产,并导入钼材料”。
用钼(Mo)代替钨,讨论一直有,SK的量产也代表一种趋势。
这次的产品原本是400 层级,后来修正为 375 层。NAND 闪存通过垂直堆叠数百层存储单元及其控制字线来提升容量;在 375 层产品中,SK 海力士决定在金属栅电极(即字线)中,将部分钨替换为钼。
在高层堆叠 NAND 结构中,钼被视为可以克服钨限制的材料。随着层数上升,线宽变窄,钨在超细结构中的电阻随尺寸缩小而上升,导致信号传输变慢。钼在细线字线结构中的电阻低于钨,有利于加快信号传输,从而提升写入和擦除速度。
此外,钨在沉积前需要先形成阻挡衬里层,每增加一层都会带来有效厚度的损失;而钼可以在无需该辅助层的情况下直接沉积,有助于实现更高密度结构。
不过,引入钼的工艺本身技术难度不低。钼前驱体在室温下为固体,需要通过加热并稳定供给的技术,才能以稳定的流量和用量进行供应。
三星电子则已在其第九代 286 层 3D NAND(于 2024 年 4 月进入量产)中导入钼金属布线。其下一代第十代 3D NAND(层数超过 400 层)计划在今年下半年实现商品化,且三星正在扩大采用钼的工艺步骤数。
用于 3D NAND 的钼材料需求预计将快速增长。业界估计,三星在去年采购或将采购约 4 吨钼,今年约 10 吨;到 2027 年预计
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一场钨的出口限制将引发WF6的缺乏。
两家日本厂(关东电化+中央硝子)合计 WF₆ 产能约 2000–2200 吨/年,占全球供应约 25%。而他们因为缺少原材料,从6月底开始停产WF6。
六氟化钨是 CVD/WCVD 工艺沉积金属钨的核心前驱体,用于接触孔填充(via fill)、金属互连、DRAM 电容和 3D NAND/HBM 结构中的钨层。
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可以共情以前大家去日本代购纸尿裤了。
怎么中国产的纸尿裤都危险☢️
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好的股票,别做那么多垃圾波段,拿住就好了。引以为戒。
忍不住想交易的时候就去多读点书看看研报做做重训。
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