DanielRomero

US imposes a 15% tariff on polysilicon
Impacts silicon cells, silicon wafers, and finished solar modules
The Semiconductor Industry Association warned that US domestic wafer capacity cannot currently meet demand, particularly for advanced 300mm wafers

Citi says the memory pullback is a buying opportunity
Reiterates Buy rating on $SKHY, raises its 2026 and 2027 operating profit estimates by 4% and 3%, respectively, and maintains its ₩3.1M price target
Citi also expects the cycle to last longer because of LTAs

Finally!
I’ve never been to Texas
I guess there’s a first time for everything

Pretty useful chart from Bernstein on MW monetization

ABF substrates are already sold out through 2028
$NVDA, $AMD, and hyperscalers are reserving capacity to secure supplies of Ajinomoto Build-up Film substrates through 2028
Customers are also encouraging suppliers to begin planning expansions for 2029–2030, including renewed co-investment arrangements

Reuters reports that $MSFT, $META, $ORCL, $AMZN, and $GOOG have $1.1 trillion in committed lease payments for leases that have not yet commenced
Microsoft disclosed $329.1 billion, Meta $279.0 billion plus another $68 billion signed in July, Oracle $260 billion, Amazon $137.2 billion, and Alphabet $85.2 billion
Oracle’s contracts generally run for 15–19 years

Ayar Labs CEO Mark Wade said co-packaged-optics scale-up deployments remain on track to ramp during 2028–2029
He identified Taiwan’s foundry, packaging and system supply chain as critical to commercialization

Coming back to this prophetic call from Morgan Stanley on June 29
Leopold should’ve read this and sold his bags ASAP

I’ll admit I’m going to miss the Situational Unawareness 13F updates and watching X go crazy over them

According to industry sources, $SKHY, $MU, and Samsung have reportedly sold out and fully allocated their entire DRAM and High Bandwidth Memory production capacity for 2027
It seems like another year of record earnings is already locked in

$SPCX down 10% in the pre-market
Probably not the way Elon thought it was gonna go

Samsung Unveils zHBM, Promising Up to 8× HBM5 Performance
Samsung unveiled zHBM, a next-generation 3D memory architecture that vertically stacks multiple HBM units directly above an AI accelerator instead of placing them beside the processor in the conventional 2.5D layout
Samsung claims zHBM could deliver:
- 4–8× higher performance than HBM5
- Up to 3× better performance per watt
- More than 50% lower thermal resistance
The main advantage is shorter data-travel distances between memory and the processor. Higher-density TSV connections make the vertical structure possible. Samsung argues th

CoPoS Moves Toward Commercialization, Taiwanese Suppliers Seize the Opportunity
$TSM and Intel are advancing glass-substrate packaging plans, with validation expected in 2026 and mass production targeted for 2028. Taiwanese equipment suppliers Grand Process Technology (3131), All Ring Tech (6187), and Gallant Precision (6640) are expected to benefit
AI chip packaging is shifting from wafer-level to panel-level production. Intel is working with Lens Technology on glass-substrate packaging, while TSMC continues to validate CoPoS, or Chip-on-Panel-on-Substrate
The next generation of CoPoS combine

Holy cow $NBIS

Huge selling pressure on semis, even after the recent institutional report updates we’ve been getting
Plus the earnings and outlook from Amazon and Samsung
Bonds not letting stocks fly at the moment

$NVDA networking chief Gilad Shainer:
“Training was complicated, but inference is harder.”
The reason is that training is relatively predictable and synchronized, while inference is more dynamic, with latency-sensitive traffic across GPUs, CPUs, storage and networks
Shainer said that Nvidia’s advantage isn’t one switch or protocol. It’s the integration of GPUs, NVLink, Spectrum-X, ConnectX, BlueField, storage and software into one synchronized system
Spectrum-X uses open Ethernet standards, but the performance comes from Nvidia’s proprietary coordination between switches, NICs and GPUs:
“This