DanielRomero

Powertech stealing all the attention at the SEMICON forum
People woke up after the $LRCX and $AMAT presentations
First automated FOPLP mass production line for HPC, using massive 515 × 510 mm panels

High-tech analogies at SEMICON by MediaTek
What happens when pizzas get too large?
You make them rectangular
Same with advanced packaging. As AI packages get larger, round wafers become too small and inefficient, and rectangular panels make a lot more sense

Physical AI is heating up
▶️ Global humanoid robot shipments exceeded 22,000 units in 1H26, up 300% YoY
▶️ Counterpoint expects more than 50,000 units in 2026, representing about 210% YoY growth
China dominates the market
AgiBot shipped about 9,700 units for a 43.1% share, while Unitree shipped more than 7,000 units for a 31.1% share
Together, they accounted for about 75% of global shipments, while the top five vendors represented 86%
By use:
· Entertainment & performance: 33.6%
· Data production & research: 27.0%
· Service & guidance: 19.0%
· Intelligent manufacturing: 12.8%
· Warehousing & l

Maybe I’m going nuts
I think $IREN is executing well and that the earnings were almost as good as $NBIS
I genuinely think the only main, clear negative lately has been the executive compensation package
Beyond that, you could argue that ARR isn’t accelerating fast enough, but that’s ultimately a timing issue with little consequence for the long-term thesis

One industry I’m becoming much more bullish on is FOPLP
I already have 2 plays, but I’m probably going to add more
I find it crazy that nobody is really talking about it on X
You have companies sold out through 2030, with revenue and orders growing at high double-digit and triple-digit rates across the industry
It’s a matter of time before it becomes a retail favourite along memory, optics and neoclouds

Samsung (005930.KS) challenges $TSM production with Panel-Level-Packaging
Samsung plans to bring its 415×510mm FOPLP platform into mass production around 2028, sticking with a significantly larger panel format than TSMC’s 310×310mm standard
The larger Samsung panel offers 2.2× the usable area of a 310×310mm panel, potentially providing meaningful unit-cost advantages. Samsung also already has high-volume PLP manufacturing experience from mobile and wearable chips, giving it existing infrastructure and expertise in warpage control
The challenge is moving the technology into AI server packaging,

Powertech ( emerges as a key advanced-packaging supplier for $AMD and $AVGO
AMD and Broadcom have already booked most of Powertech’s planned FOPLP capacity, with mass production expected to begin by mid-2027. Capacity is projected to increase from 1,000 panels/month in 2026 to 2,000 by mid-2027 and 5,000 in 2028
Powertech expects total investment in the platform to reach NT$70B, while the initial pilot-line investment is expected to break even in 2027. Management expects FOPLP to become a major growth driver from 2027 onward
Its PiFO platform uses panel-level RDL and silicon bridges to connec

$IREN projected $25–30B in FY27 capex
· $14B is already secured through prepayments and GPU financing
· Another $8B is expected through the same means
· That leaves $3–8B to be financed
· The rest will come from cash flow, data center financing, and equity issuance
The plan isn’t crazy, especially if there’s further share-price appreciation
But so many people can’t read past the headline

$IREN brings out so many dumb takes
It’s painful to read or listen to
For some reason, this company attracts the most amateur critics with the shortest attention spans

$MU today on the supply-demand equilibrium:
“We think meaningful supply will only start to ramp in 2028, and even then, it will just be the initial ramp. It will gather momentum in the years that follow.”
“It will take some time for the industry to find a new equilibrium point. Exactly when that happens, we don’t have line of sight on yet.”

$MU on Deep Memory Co-Design With Its Largest Customers:
“We are becoming embedded in the R&D roadmaps of many of our customers. They are bringing us increasingly ambitious ideas, and we are actively working on projects that stretch the capabilities of what memory can deliver.
These deep co-design relationships are difficult to replicate across multiple suppliers. Customers can typically partner this closely with only one or two companies.When you go down this path, the relationship starts to look much more like an ASIC engagement.
The customer takes greater ownership of the design, the suppl

You’re sidelined? $NVDA says it’ll grow 70% while supply is constrained, and you’re sidelined?

The implications of $NVDA projecting 70% growth in FY2028 are massive
That would put $NVDA at around $730B in revenue and $420B in operating profit
At that level, $NVDA would be trading at just 12x 2028 EBIT
How crazy does that sound?