DanielRomero

$AAPL being the second-largest company in the world by market cap in 2026, despite having barely any direct AI exposure, is genuinely impressive
No data centers, no frontier AI models, just good ol’ smartphones and laptops

Unimicron says TGV yields are still poor and is targeting 2029/2030 for mass production of glass-core substrates

Glass will be used alongside ABF build-up layers and PID, an insulating polymer layer
This substrate material transition is crucial for FOPLP

$LITE likes VCSELs for AI scale-up interconnects
Their main limitation is reach

Samsung’s zNAND-O looks amazing
10× DRAM bit density, with 7× higher read bandwidth and 7× better read power efficiency than conventional flash
3D NAND could offload a lot memory capacity from HBM, particularly for inference workloads where not all data needs HBM-class latency
First samples targeted for 2028

The US manufactured around 450 humanoid robots in 2025
China manufactured 20,000
If US humanoid production increases 1,000x from here,
Which stocks stand to capture the most value from that growth?

Powertech stealing all the attention at the SEMICON forum
People woke up after the $LRCX and $AMAT presentations
First automated FOPLP mass production line for HPC, using massive 515 × 510 mm panels

High-tech analogies at SEMICON by MediaTek
What happens when pizzas get too large?
You make them rectangular
Same with advanced packaging. As AI packages get larger, round wafers become too small and inefficient, and rectangular panels make a lot more sense