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Our country has successfully developed three-dimensional multi-layer on-chip capacitors that can be directly applied to AI/GPU chips, high-performance processors, and other high-end chips.

MeNews
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Abstract generation in progress
ME AI According to the Hubei Jiangcheng Laboratory, the laboratory has recently made a major breakthrough in key capacitor technology, successfully developing a three-dimensional multilayer on-chip capacitor with a capacitance density exceeding 1000 nanofarads per square millimeter. This capacitor can be directly applied to high-end chips such as AI/GPU chips and high-performance processors, supporting the R&D of chips with high computing power and low power consumption. At present, the relevant technologies are under process flow testing and small-batch trial production, with plans to enable large-scale application in the advanced packaging field. In a circuit, the essence of a capacitor’s role is a super-miniature “reservoir”: when the chip’s current fluctuates sharply, it can quickly charge and discharge to smooth out the voltage, ensuring the chip receives “pure and stable” current. In computing power systems, capacitors are also metaphorically referred to as “electric RAM”: HBM serves as the data buffer for computing power, while capacitors serve as the energy buffer for computing power. To be able to meet the power draw when a GPU instantly ramps up to full power, it must rely on multi-level power caches that pass the load from nanoseconds to seconds in stages. (Source: Tonghuashun)
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