Ming-Chi Kuo: CoPoS will be mass-produced in the second half of 2028, and there is no substitutive relationship between glass and ABF.

Analyst Guo Mingqi stated that TSMC's next-generation advanced packaging CoPoS is expected to enter mass production in the second half of 2028. According to research, glass materials will not replace ABF films, as chip interconnection functions are achieved through a combination of the chip-side routing layer (RDL), via/copper interconnect structures within the glass substrate, and ABF lamination layers. Therefore, glass and ABF films coexist as a complementary structure and do not serve as substitutes. (Cailian Press)
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