Futures
Access hundreds of perpetual contracts
CFD
Gold
One platform for global traditional assets
Options
Hot
Trade European-style vanilla options
Unified Account
Maximize your capital efficiency
Demo Trading
Introduction to Futures Trading
Learn the basics of futures trading
Futures Events
Join events to earn rewards
Demo Trading
Use virtual funds to practice risk-free trading
Launch
CandyDrop
Collect candies to earn airdrops
Launchpool
Quick staking, earn potential new tokens
HODLer Airdrop
Hold GT and get massive airdrops for free
IPO Access
Unlock full access to global stock IPOs
Alpha Points
Trade on-chain assets and earn airdrops
Futures Points
Earn futures points and claim airdrop rewards
Promotions
AI
Gate AI
Your all-in-one conversational AI partner
Gate AI Bot
Use Gate AI directly in your social App
GateClaw
Gate Blue Lobster, ready to go
Gate for AI Agent
AI infrastructure, Gate MCP, Skills, and CLI
Gate Skills Hub
10K+ Skills
From office tasks to trading, the all-in-one skill hub makes AI even more useful.
GateRouter
Smartly choose from 40+ AI models, with 0% extra fees
Renowned analyst: TSMC's next-generation advanced packaging technology is expected to enter mass production in the second half of 2028
BlockBeats News, June 11 — Hong Kong Tianfeng International Securities analyst Guo Mingcui posted that TSMC’s next-generation advanced packaging technology CoPoS is expected to enter mass production in the second half of 2028. It is designed specifically for ultra-large packaging built for more than 9.5 times the mask size, and NVIDIA’s Feynman AI chips may become the first adopters.
CoPoS uses a glass core substrate structure: the glass is sandwiched between the ABF build-up layers. It uses glass carrier boards and panels of specific sizes. This is neither a glass interposer layer nor a replacement for ABF. The chips are bonded to the surface of the ABF, clarifying multiple misconceptions in the industry.
Public information shows that CoPoS provides a larger panel platform and space, making it well suited for integrating CPO optical components (for example, optical engines and couplers). In the future, premium AI packaging may adopt CoPoS (large substrate) + CPO (optical I/O) at the same time, forming a complete solution.