1/ Samsung and AMD's expanded partnership is confirmed. The official statement confirms that both parties will collaborate on HBM4, EPYC DDR5, advanced packaging, and "discuss foundry opportunities for the next generation AMD products."

2/ Currently, some reports about Google's next-generation TPU "Icefish" suggest that certain I/O/memory interface chips may use Samsung's 2nm process, while the core computing die may still be manufactured by TSMC.
3/ Tesla orders are highly certain. Samsung has confirmed that its Texas factory is expected to start mass production of Tesla chips in the second half of 2027, which can be seen as strong evidence of Samsung's advanced process external customer breakthrough.
4/ The NVIDIA/Groq partnership is confirmed. NVIDIA has confirmed that Samsung will produce Groq inference chips, and both sides are also discussing next-generation foundry, HBM4E, and HBM5 collaborations.
5/ The logic of TSMC capacity constraints is valid, but "all advanced capacity locked until 2028" cannot be considered an official conclusion. Broadcom explicitly states that TSMC's capacity has become a supply bottleneck by 2026, and TSMC is also accelerating capacity expansion.