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HVLP computing power copper foil is a key substrate, with a certain manufacturer’s "orders already scheduled through the second half of 2027."
Copper foil manufacturers need to start from RTF, gradually upgrade to HVLP1-2, HVLP3-4 generations, each with a verification cycle of 6 to 12 months, and a full system-level certification process lasting 1 to 3 years.
Overseas manufacturers like NVIDIA, AMD, Intel, and domestic companies such as Huawei Ascend have strict generation requirements for copper foil, with only a few leading global companies certified.
(China Securities Golden Bull)