TSMC advances CoPoS supply chain development, aiming for mass production next year

Odaily Planet Daily News reports that Citrini analyst Jukan posted on the X platform that, according to South Korea's ETNews, TSMC is building a CoPoS materials, components, and equipment supply chain, aiming to achieve mass production next year. PLP is a technology that packages cut chips on rectangular panels; compared to circular wafer-level packaging WLP, it can reduce edge area waste; based on a standard 600×600 millimeter rectangular panel, chip output is approximately 5 to 6 times that of the mainstream 300 millimeter 12-inch wafers.
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