The European Union proposes a package of science and technology promotion legislation covering advanced semiconductors, AI, and computing-electronics collaboration.

ME AI News, Wednesday night Beijing time, the European Commission announced a package of "European technological sovereignty plans," which, in addition to the previously anticipated "Chip Act 2.0," also cover fields such as artificial intelligence (AI), cloud computing, and compute-electric collaboration. The bill specifically states that the EU plans to build the first semiconductor facility capable of advanced process manufacturing, Chiplet integration, and advanced 3D packaging, with trial production expected between 2030 and 2033. (Cailian Press) (Source: Tonghuashun)
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