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$AMD next-gen Zen 7 “Grimlock” CPUs to use TSMC’s A14 1.4nm process and could launch around 2028
According to a report by Taiwan’s Commercial Times, AMD is rumored to have started preparing its supply chain for Zen 7, even though Zen 6 has not officially launched yet
The Zen 7 CCD is expected to use a new design, potentially with up to 16 cores per CCD and much larger 3D V-Cache, with claims of up to 224 MB of L3 cache on a single 3D V-Cache CCD
AMD is reportedly evaluating Powertech’s FOPLP, or fan-out panel-level packaging, which could help improve cost, scalability, and advanced packaging capacity
For data centers, Zen 7 is expected to bring improved AI-related CPU capabilities, including updated matrix engine features and support for more AI data formats