Huawei proposed the “Tao Law” at ISCAS 2026 and introduced LogicFolding technology. By reorganizing three-dimensional spatial topology, it improves chip performance without requiring new lithography processes. The transistor density of Kirin 2026 increases from 155 to 238 MTr/mm², core energy efficiency improves by 41%, and the maximum clock frequency increases by nearly 13%. Kirin 2027 enters a Silicon state; future plans include Kirin 2028 and 2029. As for AI chips, the AI chip plan of Ascend 990 is to introduce LogicFolding around 2030, and to achieve more than a 100x improvement in hardware integration by 2035.

MeNews

2026-05-25 06:20:17

Abstract generation in progress

ME News Report, May 25 (UTC+8), Huawei's Tingbo presented the "Tao Law" at ISCAS 2026 and introduced the LogicFolding technology. This technology enhances chip performance through three-dimensional space topology reorganization without relying on new lithography processes. In testing the Kirin 2026 chip, transistor density increased from 155 MTr/mm2 to 238 MTr/mm2, performance core energy efficiency improved by 41%, and the maximum clock frequency increased by nearly 13%. The paper shows that the Kirin 2027 chip has entered the Silicon stage, with future plans including Kirin 2028 and 2029. Regarding AI chips, the Ascend 990 plans to introduce LogicFolding around 2030, and hardware integration is expected to improve by over 100 times by 2035. (Source: AiHot)

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TidepoolQuant

· 14m ago

Ascend 990 won't support logical folding until 2030; the pace of AI chips is half a beat slower than smartphones.

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GateUser-517aed04

· 3h ago

41% efficiency improvement + 13% frequency, mobile phone battery life and performance finally no longer have to choose one or the other

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CatMarketAnalysisAssistant

· 3h ago

The parameters for Kirin 2026—next year, flagship performance enthusiasts can start saving their money.

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GateUser-f78f1f3e

· 3h ago

You can make a splash without EUV. The name "Tao's Law" is clever—both a tribute and a way to establish its own identity.

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FloatingTeacup

· 3h ago

If logic folding can truly bypass the lithography bottleneck, the entire semiconductor industry will have to recalculate its accounts.

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SoftRugDetective

· 3h ago

Tao's Law + logical folding, Huawei is aiming to build its own technical discourse system, even inventing its own names.

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ReminderOfWavesCrashingAgainst

· 3h ago

Jumping from 155 to 238, this density curve is steeper than some competitors' PPT.

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GovernanceGremlin

· 3h ago

3D space reconfigured transistors, it seems chip design needs to shift from planar geometry to three-dimensional geometry.

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Lightning-FastComposure

· 3h ago

Chip efficiency improved by 41%, so I finally don't have to fry eggs while gaming in the summer.

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ForgotEverythingAfterMinting

· 3h ago

Ascend reaches a 100-fold improvement by 2035. Will those who buy AI cards now end up joining the national army in 2049?

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Huawei’s Tingbo paper on “Tao’s Law” is released, with logic folding technology enhancing chip performance

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