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$AMD announced more than $10B in investments across Taiwan’s AI ecosystem.
The goal is to expand partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure.
→ $AMD is working with ASE and SPIL on next-generation wafer-based 2.5D bridge interconnect technology, called EFB, Elevated Fanout Bridge.
→ $AMD also said it qualified the industry’s first 2.5D panel-based EFB interconnect with PTI.
→ The technology supports Venice, AMD’s 6th Gen EPYC CPU, and should improve interconnect bandwidth, power efficiency, and system economics.
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Full partner list:
→ ASE / SPIL, advanced packaging and test
→ PTI, panel-based EFB packaging
→ Sanmina, Wiwynn, Wistron, Inventec, Helios system manufacturing
→ Unimicron, Nan Ya PCB, Kinsus, substrates and PCB ecosystem
→ AIC, mechanical architecture and rack-level design