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Shenwan Hongyuan: Subsidiary’s 3.1 billion yuan technology innovation corporate bonds will be listed on the Shenzhen Stock Exchange on May 11
ME News Report, May 12 (UTC+8), Shenwan Hongyuan announced that the issuance of the first phase of the Technology Innovation Corporate Bonds by its subsidiary Shenwan Hongyuan Securities, aimed at professional investors and scheduled for 2026, concluded on April 29. The issuance scale was 3.1 billion yuan. Among them, Product One had a scale of 1.4 billion yuan, a 2-year term, and a coupon rate of 1.65%; Product Two had a scale of 1.7 billion yuan, a 3-year term, and a coupon rate of 1.73%. After review by the Shenzhen Stock Exchange, these bonds were listed on the Shenzhen Stock Exchange starting May 11, and are traded among institutional investors within the professional investor segment. (Source: Jinshi)