Scientists develop a new chip-stacking process, increasing the integration density of high-bandwidth memory by four times

Mars Finance News: Scientists from the Korea Institute of Industrial Technology and researchers at Pohang University of Science and Technology have developed a new process that can reliably stack more than 10 ultra-thin semiconductor chips, achieving an integrated density of about 4 times that of commercial high-bandwidth memory (HBM). This breakthrough is expected to help ease the storage bottleneck faced by artificial intelligence (AI). The related paper was published in the latest issue of the journal Engineering Achievements. (Caixin)
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