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Samsung and SK Hynix postpone application of hybrid bonding packaging process as industry urgency has significantly decreased.

MarsBitNews
Mars Finance News, Samsung Electronics and SK Hynix originally planned to use hybrid bonding technology for HBM4, but are currently reconsidering. Hybrid bonding is a semiconductor advanced packaging technology, and the industry expected it to be first used in 16-layer HBM4E. The two companies reportedly decided to continue using traditional thermal compression bonding technology, as the industry relaxed HBM thickness standards and delayed plans to adjust to high customer stack demands. (Cailianshe)
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