Sources say TSMC significantly expands PIC production capacity, expected to reach 25k wafers per month by 2028.

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Jinse Finance reported on July 8 that, according to institutional forecasts, TSMC's photonic integrated circuit (PIC) production capacity is set to rise rapidly. TSMC's capacity will increase from the current level of about 500 wafers per month to 10k wafers per month in the second quarter of 2026, further to 15k wafers per month in the fourth quarter, and is expected to reach at least 25k wafers per month by 2028. Institutions estimate that based on 648 dies per wafer, after TSMC's PIC monthly capacity rises from 500 wafers to 10k wafers, its annualized output will surge from about 4 million to 78 million units. If capacity further reaches 25k wafers per month, the annualized PIC output is expected to reach 194 million units. (Jin10)
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