TSMC is reportedly significantly expanding its PIC capacity, expected to reach 25k wafers per month by 2028.

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According to institutional forecasts, TSMC's photonic integrated circuit (PIC) capacity will see rapid growth. TSMC's capacity will ramp up from the current level of about 500 wafers per month to 10k wafers per month in the second quarter of 2026, further increase to 15k wafers per month in the fourth quarter, and is expected to reach at least 25k wafers per month by 2028. The institutions estimate that, based on each wafer containing 648 dies, after TSMC's PIC capacity increases from 500 wafers to 10k wafers per month, the annualized output will surge from about 4 million to 78 million units. If capacity further reaches 25k wafers per month, annualized PIC output is expected to reach 194 million units. (Cailianshe)
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