Advanced packaging concept oscillates and rebounds, Huatian Technology surges to limit-up.

Mars Finance News: The advanced packaging concept saw a pullback and rebound, with Huatian Technology rising straight to the daily limit up. Dagang Shares, Tongfu Microelectronics, Yangtze? Changdian? Technology? (long?). Shenzhen Technology, and Jingfang Technology also followed suit. On the news front, He Tingbo, head of Huawei’s semiconductor division, released version V2 of “Time Microtheory for Multi-Level Electronic Systems” (“Tao’s Law”) on July 3, clarifying five implementation technologies: LogicFolding unit-level 3D stacking, hybrid bonding, TSV, a unified bus, and the Hi-ONE optical engine. (Cailianshe)
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