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Three Major Diamond Industry Signals Are Shining: China’s Leading Companies Keep Expanding Rapidly—Can Rubin Unlock a Trillion-CNY Market?

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Abstract generation in progress
Diamond has a thermal conductivity of 2000-2200 W/(m·K), which is more than five times that of copper and nearly 15 times that of silicon, with a coefficient of thermal expansion highly matched to silicon (approx. 1.1 ppm/K vs. silicon's 2.6 ppm/K). It is currently the only known heat dissipation material that simultaneously meets the three major requirements of ultra-high thermal conductivity, low thermal stress, and electrical insulation. The global market for diamond heat sinks used in AI chips is expected to reach approximately 8.7 billion RMB in 2026 and is projected to grow rapidly to 59.2 billion RMB by 2030, with a CAGR exceeding 50%. China accounts for more than 95% of the world's man-made diamond production, and the industrial chain is undergoing a strategic upgrade from "industrial abrasives" to "functional heat dissipation."
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