Citrini analyst: China’s CXMT tests a bonded DRAM pilot production line; Korean media says its technology and development speed may be ahead of South Korean rivals.

Odaily Planet Daily News Citrini analyst jukan posted on X platform, stating that South Korean media reported that China's CXMT is currently testing a bonded DRAM trial production line in Hefei, aiming to achieve high-performance DRAM without using EUV lithography. Bonded DRAM is a technology in which memory cell arrays and peripheral circuits are manufactured on different wafers and then bonded together. This method can produce ultra-high-density DRAM using only multi-patterned deep UV DUV lithography, without the need for EUV equipment.

Samsung Electronics is developing its own bonded DRAM under the "B1b" project, and SK hynix is also advancing similar technology. South Korean media warned that there are assessments suggesting CXMT may currently be ahead of its South Korean competitors in terms of the technology itself and the speed of development.