🚨Korean media report that China’s CXMT is currently testing a pilot production line for bonded DRAM in Hefei, aiming to achieve high-performance DRAM without using EUV lithography.

Bonded DRAM is a technology in which the memory cell array and the peripheral circuitry are fabricated on separate wafers and then bonded together. This approach enables the production of ultra-high-density DRAM using only deep ultraviolet (DUV) lithography with multi-patterning, eliminating the need for EUV tools.
Samsung Electronics is developing its own bonded DRAM under the “B1b” project, while SK hynix is pursuing a similar technology. However, Korean media warn that there are assessments suggesting CXMT may currently hold an edge over its Korean rivals in both the technology itself and the speed of development.