AI Drives Micro LED Optical Interconnects: Commercial Expectations Rise in 2027

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At the Munich Shanghai Electronics Show, the next-generation high-speed optical interconnect solution from SmartSens made its debut for the first time. Wang Wenxuan, co-general manager of the company’s High-Speed Optical Interconnect BG, revealed: “The Micro LED high-speed optical interconnect solution is expected to be commercially deployed by 2027.” With the rapid surge in demand for data-center transmission rates driven by large models, traditional copper cabling has already shown strain in terms of bandwidth, power consumption, and transmission distance—“optics over copper” has become an inevitable trend. However, as optical interconnects move from the board level to deeper chip-to-chip integration, traditional laser light source approaches are constrained by physical characteristics such as poor high-temperature tolerance, making it difficult to be directly integrated over extremely short distances. Therefore, among CPO light sources, in addition to mainstream silicon photonics integration solutions and VCSEL (Vertical-Cavity Surface-Emitting Laser) solutions, Micro LED as an emerging optical interconnect light source is starting to break through and rise rapidly. (21st Century Business Herald)
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