The chip manufacturer shifts the engineering burden to the substrate layer, and the supply chain bargaining power will be reshuffled again — SemiAnalysis's judgment is quite harsh.

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CoinNetwork
CoinWorld News, SemiAnalysis stated on the X platform that SPHBM4 shifts the complex engineering burden of AI chips to the substrate layer, prompting chip manufacturers to purchase oversized, high-layer-count ABF substrates, or adopt glass substrates when performance demands require it.
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