Lanzhou Technology: Plans to complete the engineering development of the third-generation MRCD/MDB chips this year

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Jinse Finance reports, July 3 news: during a research and survey of specific targets, Montage Technology stated that, as the lead drafter of the international standard for MDB chips, the company drives innovation in related technologies and maintains a leading position in the industry. In January 2025, we launched the second-generation MRCD/MDB chip. In the most recent two quarters, shipments have increased significantly. Our products have earned recognition from major global memory module manufacturers for their excellent performance and outstanding stability, laying the foundation for subsequent large-scale rollout across the industry. In addition, we plan to complete the engineering R&D for the third-generation MRCD/MDB chip this year to continuously strengthen our technological leadership. (Jin Shi)
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