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Tech Taiwan reports:
TSMC’s CoPoS is expected to enter mass production in the first half of 2029.
Samsung Electro-Mechanics (SEMCO), a Samsung Group affiliate, along with Japan’s Toppan and other substrate manufacturers across Japan and South Korea, have all joined the race to develop glass-core substrates and have recently begun submitting engineering samples to TSMC.
TSMC never even considered glass interposers.