ASE raises advanced packaging quotes by up to 20%

Mars Finance News: ASE Technology, a global leading outsourced semiconductor assembly and test (OSAT) provider, has once again adjusted its packaging quotes, with price increases of up to over 20%. This round of price hikes covers various advanced packaging technologies, including Chip-on-Wafer-on-Substrate (CoWoS) and Fan-out Chip-on-Substrate (FoCoS), and its major U.S. customers are also affected. ASE Technology CEO Wu Tianyu stated that the price increase first reflects the rise in raw material prices, which is necessary; second, it reflects the increase in capital expenditure, i.e., consideration of investment costs. (MoneyDJ)
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