The next generation of AI chips will all revolve around HBM.

ME AI News: On June 30, renowned semiconductor research authors Vikram Sekar and Austin Lyon discussed that the data transfer between AI chips and HBM is like putting a refrigerator in the garage—every time you cook, you have to run back and forth. In the future, the core of AI chip architecture will be designed around memory bandwidth. (Source: Wall Street Insights)
View Original
This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.
  • Reward
  • Comment
  • Repost
  • Share
Comment
Add a comment
Add a comment
No comments
  • Pinned