Tongyou Technology: plans to raise no more than 1 billion yuan through a private placement, to be used for the construction of AI full-scenario enterprise-level storage systems and an SSD R&D center, among other projects.

ME AI News: Tongyou Technology announced that it plans to raise no more than 1 billion yuan through a private placement of A-share stocks to specific parties. After deducting issuance expenses, the net proceeds will be used for the construction projects of an enterprise-level storage system and an SSD R&D center for AI across all scenarios, the enterprise-level storage system and SSD intelligent manufacturing project, the marketing experience center project, and to supplement working capital. The number of shares to be issued in this offering will not exceed 144 million shares, and the offering price will be no less than 80% of the company’s average stock trading price over the 20 trading days prior to the pricing benchmark date. (Source: Tonghuashun)
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