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T. Rowe Price: The next wave of AI opportunities may lie further upstream in the supply chain
ME AI News: T. Rowe Price Group portfolio specialist Amanda Ng pointed out in a report that the next phase of AI-related investment opportunities may appear further upstream in the supply chain, rather than in the high-profile AI platforms or chip manufacturers.
She noted that areas such as advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCBs) are becoming increasingly critical. Although these components account for a relatively small portion of the total bill of materials required for AI, they could still become key bottlenecks. She also mentioned that even a small increase in the price of these products can significantly boost manufacturers' profits while remaining affordable for end customers. (Jinshi) (Source: MLion)