$AMD is getting close to becoming a trillion-dollar company


Mapping its supply chain seems like a smart choice
Some companies involved:
Packaging
PTI ( AMD says it qualified the industry’s first 2.5D panel-based EFB interconnect with PTI, and PTI has reportedly landed AMD orders for panel-level packaging
ASE ( / $ASX) is AMD’s partner for the next-generation 2.5D EFB bridge interconnect, and is also reportedly handling the packaging for AMD’s future MI500 CPO solution
Substrates
Unimicron ( Nan Ya PCB ( and Kinsus ( are all AMD substrate suppliers, while Absolics / SKC (011790.KS) is close to AMD approval for glass substrates
Co-packaged optics (MI500)
GlobalFoundries ($GFS) is the reported fab partner for AMD’s future MI500 CPO
Sivers Semiconductors ($SIVE): Sivers’ laser arrays are being designed into GlobalFoundries’ silicon photonics reference designs, and GF is the company tied to AMD’s MI500 CPO, which make Sivers a potential supplier
Helios Rack
AIC ( reportedly handles the structural design for AMD’s Helios rack-scale platform
Celestica ($CLS) is the partner for Helios scale-up networking switches
Wiwynn ( is in AMD’s AI server ecosystem and has a strategic partnership with Ayar Labs to bring co-packaged optics into rack-scale systems
Wistron ( Inventec ( and Sanmina ($SANM) are partners for ODM, system integration, and manufacturing of AMD Helios
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