According to BlockBeats, on June 22, Samsung Electro-Mechanics began mass production of FC-BGA (Flip Chip Ball Grid Array) substrates for Qualcomm's first data center AI accelerator, the AI200, at its Busan factory.


The AI200 was released by Qualcomm in October 2025, designed for AI inference workloads, and equipped with a custom Oryon CPU and Hexagon NPU cores.
This collaboration marks Samsung Electro-Mechanics' expansion from the mobile and personal computer markets into data center infrastructure alongside Qualcomm.
QCOM-3.02%
View Original
This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.
  • Reward
  • Comment
  • Repost
  • Share
Comment
Add a comment
Add a comment
No comments
  • Pinned