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According to BlockBeats, on June 22, Samsung Electro-Mechanics began mass production of FC-BGA (Flip Chip Ball Grid Array) substrates for Qualcomm's first data center AI accelerator, the AI200, at its Busan factory.
The AI200 was released by Qualcomm in October 2025, designed for AI inference workloads, and equipped with a custom Oryon CPU and Hexagon NPU cores.
This collaboration marks Samsung Electro-Mechanics' expansion from the mobile and personal computer markets into data center infrastructure alongside Qualcomm.