The glass substrate boom is here—full-scale acceleration across the industry chain

Key catalyst: TSMC has officially released its CoWoS glass substrate development plan, working with major supply-chain giants for industrialization validation, signaling that the technology has entered the eve of pre-mass production.
As AI chips keep getting larger, traditional organic/silicon substrates can no longer handle it (warping, heat, and poorer signal quality). With the physical advantages of being “more stable, flatter, denser, and faster,” glass substrates have become the only solution to the bottleneck in high-compute packaging.
TGV end-to-end leader: Vogo Optoelectronics (covering the full process of thinning, drilling, and copper filling, and delivering samples to leading customers).
Equipment resilience pioneer: Dier Laser (TGV laser micromachining equipment has shipped), Han’s Laser, and Delong Laser.
Panel cross-industry giants: BOE Technology (building and deploying trial lines, partnering with Corning), Rainbow Co., Ltd. (technology migration for high-generation lines), TCL Technology.
Packaging and testing deployment platform: JCET Group (completed validation), Tongfu Microelectronics (partnered with AMD, with deep technical reserves).
Key materials/consumables: Kaisheng Technology (ultra-thin glass base sheets), Tiancheng Technology (electroplating copper-filling chemicals), Aisen Co., Ltd. (photoresists).
The industry timeline will be: equipment first → trial-line validation → small-batch production in 2027 → large-scale mass production in 2028.
Right now may be the critical window for laying the groundwork from 0 to 1!