Today, I will give everyone an overview of a material that has一直 been bottlenecked—epoxy encapsulation material.

As the core material for semiconductor packaging, epoxy encapsulation material has一直 been monopolized by Japan's dual oligopoly in the industry, with very rigid supply, holding a 30% global market share, and products are in short supply.
Only one domestic company is slowly breaking through the monopoly, accelerating the realization of domestic substitution, with its market share gradually increasing.
It is deeply tied to the three major domestic packaging and testing giants: Changdian, Tongfu, and Huatian.
I won't mention the specific names here; please refer back to what I mentioned earlier.