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CITIC Securities: Diamond heat dissipation continues to iterate, with the fastest commercialization of diamond heat sink plates and diamond copper composite materials.

MarsBitNews
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Mars Finance News, CITIC Construction Investment Research reports that the continuous expansion of the computing power industry has driven significant improvements in chip integration and power density. Under high heat flux density, traditional copper-based cooling materials have reached a bottleneck. Diamond's thermal conductivity far exceeds that of materials like copper, silver, silicon, and silicon carbide, making it a key direction to overcome the bottleneck in high-end chip cooling. Currently, diamond cooling materials include three main approaches: diamond-based composites, single-crystal diamond, and polycrystalline diamond. The technical routes are not yet fully finalized, with diamond-copper composites balancing performance and cost, leading the industrialization pace. Applications include diamond substrates, diamond heat sink plates, and diamond microchannel cooling forms. Diamond heat sink plates and diamond-copper composites are the fastest to commercialize, with related products already available from domestic and international manufacturers. Diamond is extending from traditional abrasives and cultivated diamonds to functional materials such as thermal management for semiconductors and high-power devices. The growth of AI computing power continues to open up space for ultra-high thermal conductivity diamond materials, with a focus on mass production and customer certification progress.
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