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Huawei says that by 2031, chips will reach an equivalent 1.4-nanometer level, and announces a three-year product roadmap for its Kirin chips (including video)
【Caixin.com】 Huawei chip progress has drawn attention from both within and outside the industry. On May 25, at the International Symposium on Circuits and Systems ISCAS 2026, He Tingbo, a director of Huawei and president of its semiconductor business unit, said that by 2031, the transistor density of Huawei’s high-end chips based on the τ (tau) law is expected to reach the same level as the 1.4-nanometer process. TSMC previously announced that it will start mass production of A14 (1.4-nanometer) process chips in 2028.
Fueled by this news, semiconductor sector stock prices surged on May 25. Semiconductor foundry Huahong (688347.SH) hit the daily limit for 20cm, SMIC (688981.SH) rose 18.78%, and Jinghe Integration (688249.SH) rose 10.03%; EDA software stocks Huada Jiutian (301269.SZ) rose 15.04%, Guangliwei (301095.SZ) increased by 8.97%, and Gotion Semiconductor (688206.SH) rose 13.19%; packaging manufacturer Shenghe Jingwei (688820.SH) rose 13.82%, Changdian Technology (600584.SH) rose 10% to hit the daily limit, and Tongfu Microelectronics (002156.SZ) rose 9.99%; equipment manufacturers Northern Huachuang (002371.SZ) rose 4.36%, Weimu (688012.SH) rose 3.34%, and Tuojing Technology (688072.SH) surged 16.86%.