Huawei’s “Tao (τ) Law” centers on multi-layer chip vertical stacking combined with 3D hybrid bonding, reshaping the iteration paradigm and raising requirements for copper plating, surface flatness, cleanliness, alignment, and more—driving increased demand for copper plating, CMP, hybrid bonding equipment, cleanrooms, and related areas. Domestic production capacity is tight, and the gap in advanced process capabilities still remains; in the long run, demand is expected to support capacity expansion. The multi-layer architecture increases the need for equipment precision, so attention should be paid to advanced packaging testing, TSV etching, CMP, and other new equipment and processes.

金色财经_

2026-05-26 02:00:05

Abstract generation in progress

Golden Finance reports that on May 26, China Merchants Securities said that Huawei released the “Tao (τ) Law,” a guiding principle for innovation in the advanced semiconductor field. It is expected to reshape the semiconductor iteration technology paradigm, thereby driving technology updates across the upstream and downstream industry chains. It is recommended to focus on foundry, advanced packaging and testing, equipment, and other fields.

Analyst Yan Fan’s team noted in its report that the “Tao (τ) Law” core logic for folding and 3D folding is built on multi-layer chip vertical stacking and hybrid bonding. This, in turn, requires more stringent copper plating technology, surface smoothness, cleanliness, and bonding alignment accuracy. This will systematically increase demand for related copper plating equipment, chemical-mechanical polishing (CMP) equipment, hybrid bonding equipment, cleanrooms, and related consumables. Currently, in China, SMIC and Hua Hong’s capacities are in short supply, and there is a supply-demand gap in advanced process technology. In the long run, healthy growth in domestic demand will accelerate expansion of production capacity. Huawei’s commercial validation of logic folding and 3D folding will create strong incremental demand for advanced packaging.

Multi-layer vertical heterogeneous architectures impose higher requirements on equipment precision. It is recommended to focus on the incremental demand for advanced packaging testing equipment, including TSV etching equipment, CMP equipment, and others.

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