Few people know what the core of this is

He Tingbo: The Kirin chip, which is set to debut in the fall of 2026, will adopt logic folding technology, and its performance is expected to be greatly improved,
It is estimated that by 2031, high-end chip transistor density can reach the same level as 1.4-nanometer process technology. This means there are still 5 years to reach the same level as the world's most advanced process.
If we follow the old path, this gap could be more than 10 years, or it may always be behind.
The core principle of "Tao's Law" can be summarized in one sentence: replacing "geometric miniaturization" with "time compression"
After reaching physical limits, theoretically, current technology can also shift to "time compression"
So, when "geometric miniaturization" + "time compression" are combined,
In fact, our gap will continue to widen.
But currently, the industry chain is far behind in "time compression."
The key is photon technology; only photons, after folding design,
have shorter communication times and do not generate heat.
The current route needs to shift, but what is lacking is not just technology, but path dependence, making it difficult to turn.
When the entire system is designed around physical limits,
shifting to time compression is equivalent to starting over.
They no longer have time to catch up.