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Techub News reports that, according to CryptoBriefing, SK Hynix has begun receiving Intel's EMIB substrates for integration testing, and both companies are collaborating on research into 2.5D packaging technology, aiming to connect high-bandwidth memory (HBM) and logic chips more efficiently and reduce dependence on a single foundry. Intel's EMIB technology currently has a yield rate of 90%, making it an alternative to TSMC's CoWoS. SK Hynix previously announced an investment of $3.9 billion in the United States to build a 2.5D HBM packaging facility. If this technology reduces the production costs of HBM chips, it could ultimately impact the prices of crypto mining hardware and miners' profitability.