Quick Summary of Recent Sidechain Developments

Quick summary of recent semiconductor developments:

1. $TSM is pushing hard on CoPoS - VisEra/other parties may explode earlier than expected.
2. $AAPL is choosing $INTC for semiconductor manufacturing, a major change because they usually choose TSM. Made in America like Intel is booming.
3. Vera Rubin is reported to have recently changed its cooling architecture. “Taiwan heat management suppliers are emerging as one of the fastest-growing segments in the AI hardware ecosystem” - From last month. “The Vera Rubin server architecture is expected to drive fundamental changes in data center cooling and system design.” Will mention the heat ecosystem later, maybe it’s time to consider?
4. 2D NAND shortage escalates after Samsung, Micron, and competitors withdraw from the market. Macronix, Windbond boom. Implications for GigaDevice and other niche players.
5. “Big Tech is reported to propose funding for SK Hynix fabs and EUV.”

• Memory bottlenecks are so severe that mag7 wants to pay for it, so $MU, SK Hynix, Samsung boom.

6. $NVDA net revenue in 2026 is projected at $12.6 billion for April 2026. Revenue up 30%, Semis continue to boom.
7. Anthropic needs computing power -> SpaceX. So the significance for computing demand here is extreme, it’s a BOOM for $TSM and others. But it’s very interesting that they avoid Neoclouds and choose SpaceX.
8. “SKC will accelerate mass production of glass substrates for US customers by the end of this year.” “By the end of this year, earlier than the initial plan, as announced.” Glass substrate players like $NBIS for mass production and other stakeholders like SKC are booming. Glass schedule is accelerated. Heavy glass boom.
9. “Deepening chip shortage as AI server demand and GaN wars escalate.” Maybe it’s time to consider the bottleneck at the power chip, anon?
10. “Adata says contract prices for DRAM and NAND flash will increase by over 40% in Q2 2026.” Another positive signal for $MU, SK Hynix, Samsung, $SNDK, and others.