Perhaps the computing power of a single card is approaching its limit, so the only way is to horizontally parallelize to enhance the cabinet's computing power (in fact, China is focusing on developing overall cabinet computing power due to advanced process limitations).

Since it's horizontal parallelization, the bottleneck becomes data transmission and bandwidth, so HBM, optical interconnects, and other technologies are needed. Because more XPUs are connected in parallel, heat dissipation becomes a major issue, leading to the rise of liquid cooling and thermal materials.
At the same time, power consumption is also very high, making electricity resources a necessary strategic resource.