The three storage giants bet on new DRAM technology, potentially opening up two types of interface chip markets.

The latest generation standard for server DRAM modules, “MRDIMM,” is reportedly in the final development stage. Members of the Joint Electronic Equipment Engineering Committee (JEDEC), including major memory companies such as Samsung Electronics, SK Hynix, and Micron, are actively developing MRDIMM products to meet the growing future demand. Unlike HBM integrated with GPUs, MRDIMM will be used as the main memory directly accessible by the CPU. As a new generation of server DRAM modules, it is optimized for artificial intelligence and high-performance computing (HPC) tasks, capable of running two memory channels simultaneously, thus providing faster data processing speeds. (Cailian Press)