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Shengmei Shanghai's first PECVD SiCN equipment was successfully delivered
On April 27, Shengmei Shanghai announced that its first plasma-enhanced chemical vapor deposition (PECVD) carbon nitride silicon (SiCN) equipment has officially rolled off the line. The equipment is designed to support PECVD NDC (SiCN) processes for backend metal interconnection process applications in high-end IC manufacturing at 55 nanometers and below. Application scenarios include copper oxidation suppression, copper diffusion barrier layers, and etch stop layers. (People’s Financial News)