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Hengbo Co., Ltd.: Plans a targeted share issuance to raise up to 1.8 billion yuan for projects including PEEK components
Hengbo Co., Ltd. Announcement: The company plans to issue A-share stocks to specific targets, raising a total amount of funds of no more than 1.8 billion yuan, which will be used for projects including the industrialization of PEEK precision components in Malaysia and Taizhou, the smart factory in Jiangmen, the capacity expansion in Changzhou, the expansion of the R&D center, and supplementary working capital.