Hongming Electronics applies for patents related to the preparation of PTC resistors, manufacturing thermistors, with excellent performance meeting application requirements

April 2 news, information from the National Intellectual Property Administration shows that Chengdu Hongming Electronics Co., Ltd. has applied for a patent titled “Preparation Method of Miniaturized Encapsulated PTC Thermistor for Temperature Compensation.” The application publication number is CN121768787A, the application number is CN202511838469.7, the application publication date is March 31, 2026, and the application date is December 8, 2025. The inventors are Gu Lihuan, Xiang Yan, Wei Jie, Xie Cheng, Wang Yan, Yang Bo, Yuan Bo, Cheng Feipeng, and Chen Qiang. The patent agency is Chengdu Huachen Zhihes Intellectual Property Agency Co., Ltd., and the patent agent is Li Yang. The classification numbers are H01C17/065, H01C17/075, H01C17/28, H01C17/30, H01C17/02, H01C7/02.

The patent abstract shows that the invention discloses a preparation method for a miniaturized encapsulated PTC thermistor for temperature compensation, which belongs to the technical field of PTC thermistor production. The method includes the following steps: ingredient preparation — after mixing titanium oxalate barium oxide, strontium titanium oxalate, barium carbonate, tin dioxide, yttrium trioxide, titanium dioxide, and silicon dioxide evenly, they are granulated and pre-sintered to form PTC ceramic powder raw material; making ceramic green bodies; sintering to obtain resistor blanks; preparing nickel electrodes; preparing silver electrodes; dicing to obtain resistor chips; soldering leads outward; encapsulating to form a double-layer encapsulation structure, thereby obtaining a miniaturized encapsulated PTC thermistor for temperature compensation. The miniaturized encapsulated PTC thermistor for temperature compensation prepared by this invention has a wider resistance range, a wider operating temperature range, a wider temperature coefficient range, higher resistance accuracy, and a smaller volume, better meeting application needs for encapsulated PTC thermistors for temperature compensation.

Hongming Electronics was established on October 8, 1981, and is scheduled to be listed on the Shenzhen Stock Exchange on March 25, 2026. The company’s registered address and office address are both located in Chengdu, Sichuan. It is a leading domestic enterprise of new electronic components, focusing on resistor-capacitor components, with solid technical accumulation and advantages across the entire industrial chain.

The Shenwan industry classification for Hongming Electronics is Defense Military Industry - Military Electronics II - Military Electronics III, involving concept sectors such as new shares and “second-new” shares, the MLCC concept, automotive electronics, etc. Its main business is R&D, production, and sales of new electronic components mainly centered on resistor-capacitor components, providing high-performance and high-reliability products. It also involves precision sub-assembly components business, and its products are used in fields such as consumer electronics, new energy batteries, and automotive electronic structural parts.

In terms of operating performance, in 2025, Hongming Electronics’ operating revenue reached 2.617 billion yuan, ranking 5th among 11 companies in the industry. The industry leader, AVIC Optoelectronics, had 21.386 billion yuan; the second-place company, Aerospace Electrical, had 5.82 billion yuan; the industry average was 4.035 billion yuan; and the median was 2.213 billion yuan. Net profit was 461 million yuan, ranking 2nd in the industry, with the industry leader AVIC Optoelectronics at 2.35 billion yuan, the industry average at 227 million yuan, and the median at 102 million yuan.

Recent patent situation of Chengdu Hongming Electronics Co., Ltd. is as follows:

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