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The AI track continues to heat up, with institutions: Semiconductor industry prosperity improving
Ask AI · What’s the connection between the semiconductor price-hike wave and AI computing power?
【Global Times Finance, based on a composite report】According to data from Eastmoney, as of 10:25 on March 25, the CSI Artificial Intelligence Industry Index rose by 3.16%. Among constituent stocks, Huanhuan Xinwang hit the 20cm daily limit, Aofei Data rose 9.03%, Fiberhome Technology rose 5.66%, and companies such as UCloud and Runze Technology also moved up in tandem. The Artificial Intelligence ETF rose 3.15%; as of March 24, its cumulative gain over the past year reached 62.89%.
A report by Shenwan Hongyuan analyzes that AI is driving demand for high-end PCBs, putting higher requirements on drill bits. The global PCB industry is entering a new growth cycle driven by the application of emerging technologies, with core momentum coming from the rapid growth in demand across key frontier areas such as AI and high-performance computing. The global PCB industry is accelerating its evolution toward higher performance and higher density; changes such as material upgrades and higher layer counts also impose higher requirements on drill-bit breakage rate, aspect ratio, and wear resistance (service life).
(Image/Eastmoney IC)
Shanxi Securities believes that semiconductor industry sentiment is improving. The AI computing power boom, together with faster penetration of new energy vehicles, is driving a surge in demand for power devices, analog chips, and passive components. Combined with structural contraction on the supply side and capacity constraints, this forms an end-to-end price-rising cycle. Power devices benefit from the penetration of HVDC technology, and the unit value of SiC/GaN devices increases. The analog chip inventory cycle has turned around; high-end products squeeze capacity, and cost pressure transmits through to push volume and price upward together. For passive components, price increases driven by gold/silver (precious metals) and contract manufacturing/testing/packaging have pushed the entire industry into a top-down, full-category coverage price-rising cycle. (Wen Hui)