Research Brief | Jiangsu Aisen Semiconductor Hosts Tianfeng Securities and 18 Other Institutions; Focus on Large-Scale Production of Advanced Packaging Photoresists and Electroplating Solutions by 2026

March 27, Jiangsu Aisen Semiconductor Materials Co., Ltd. (hereinafter referred to as “Jiangsu Aisen Semiconductor”) disclosed an investor relations activity record table showing that between March 12, 2026 and March 26, 2026, the company received investigations from 18 institutions, including Tiegong Securities (rights protection), Guojin Securities, Biao Pu Investment, Fosun Zhizao, Ping An Securities, GF Securities, Yangtze Securities, Shenwan Hongyuan Securities, Zhe Shang Securities, China Post Securities, Zhongtai Securities, Huatai Securities, Taikang Asset Management, Changsheng Fund, GF Fund, Nuoan Fund, CMB Fund, and Yinhuia Fund, through broker strategy meetings and on-site visits by the company and in other forms.

The company’s Executive Vice President, Board Secretary Chen Xiaohua, Compliance Director Li Yuanyuan, and Securities Affairs Representative Xu Wen participated in this reception.

Basic Information on the Research

The category of this investor relations activity covers specific-object research, roadshow activities, and other forms. The activity locations include on-site broker strategy meetings and within the company, aiming to conduct in-depth communication with institutional investors on core issues such as the company’s strategic layout.

2026 Strategic Layout: Dual Drivers of Products and Customers

During the research, institutions focused on the company’s strategic layout directions for 2026. The company stated that in the new year it will take “technology implementation + capacity release” as the core, focusing on two strategic product lines: advanced packaging photoresists and advanced process electroplating solutions, accelerating large-scale production and market penetration.

On the client side, the company will adhere to “deep cultivation of core customers + breakthrough in incremental markets.” On the one hand, it will deepen and consolidate cooperation stickiness with leading advanced packaging enterprises to strengthen its advantageous position in deep docking with major domestic wafer manufacturing plants; on the other hand, it will actively expand into storage chip manufacturers and overseas high-end customer groups to broaden international customer coverage and enhance the resilience of the global supply chain.

The company emphasized that this research did not involve any material information that should be disclosed.

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