Yongxie Electronics DiFEM module packaging technology breaks through ultra-thin size

Jinshi Data, February 17, according to Yongsi electronic news, DiFEM module, as an important form of RF front-end modularization, can realize the reception and processing of multiple signals by integrating RF switches and filters, which can reduce the size while improving integration and performance to meet the needs of mobile intelligent terminal products. The innovation of DiFEM module packaging technology is one of the key factors driving the performance improvement of communication equipment. Yongsi Electronics has made a breakthrough in the field of DiFEM module packaging, using FCLGA packaging technology to highly integrate RF switches and multiple filter chips to achieve ultra-thin package size.