Jin10 data reported on July 28, Aiwei Electronics announced that the company plans to issue convertible corporate bonds to raise no more than 1.901 billion yuan, which will be used for the construction of a global research and development center, edge AI and supporting chip research and development and industrialization projects, in-vehicle chip research and development and industrialization projects, and motion control chip research and development and industrialization projects.
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Aiwei Electronics: Plans to issue no more than 1.901 billion yuan of convertible bonds for edge AI and supporting chip projects
Jin10 data reported on July 28, Aiwei Electronics announced that the company plans to issue convertible corporate bonds to raise no more than 1.901 billion yuan, which will be used for the construction of a global research and development center, edge AI and supporting chip research and development and industrialization projects, in-vehicle chip research and development and industrialization projects, and motion control chip research and development and industrialization projects.