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Advanced packaging concept continues to recover; Qipai Technology hits 20cm limit-up.

MarsBitNews
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Mars Finance news: the advanced packaging concept continued to warm up during trading. Qipai Technology hit the limit up with a 20cm gain, Yongxi Electronics rose more than 10%, and Weiteou, Galaxy Microelectronics, Sanjia Technology, Weice Technology, and Qizhong Technology followed suit. On the news front, according to MoneyDJ, global leading outsourced semiconductor assembly and test (OSAT) supplier ASE Technology has once again adjusted its packaging quotes, with the price increase reaching more than 20% at most. This round of price hikes covers various advanced packaging technologies, including wafer-level substrate chip packaging (CoWoS) and fan-out substrate chip packaging (FoCoS), and major US customers are also affected. (Cailianshe)
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